... Congress Cataloging -in- Publication Data:Nutaro, James J. Building softwarefor simulation: theoryandalgorithmswithapplicationsin C+ + / James J. Nutarop. cm.Includes bibliographical references ... 5n c +10d c +25q c 17Check the cancel button18cancel ← cancel is in xb19end method20Algorithm 3.3 State transition function for the coffee-vending machine.method getCoins(cents) returns C 1Initialize ... by the machine is printed, the program cleans up, and then it exits.Main Function for the Coffee Machine Simulation 1 #include "CoffeeMachine.h"2 #include "CoffeeMachineListener.h"3...
... diversity combining and propose maximum-likelihood(ML) algorithmsfor ATR with delay-Doppler uncertainty. In Section 5, we provide simulation results on ML-ATR with delay-Doppler uncertainty. In Section ... system. Therefore, it is significantto perform signal design and processing and networking co-operatively within and between platforms of radar sensors and their communication modules. In this paper, ... algorithm for RSN. We will study both fluctuating tar-gets and nonfluctuating targets.4.1. ML-ATR for fluctuating targets with delay-Doppler uncertaintyFluctuating target modeling is more realistic in...
... semiconductor. This process of introducing additional carriers (excess carriers) is called carrier injection and can occur in different ways (optical, electrical, etc). Note that the injection refers ... definition is the free electron (or hole) concentration in intrinsic silicon, often called the intrinsic carrier concentration. Effective Mass of Electron and Hole. The electrons in the conduction ... the accuracy of the model in predicting device characteristics over the operating range of interest and the computational efficiency of simulating large circuits. As the size and the complexity...
... drain overlap capacitance per unit length F/cm Gate to bulk overlap capacitance per unit length F/cm Intrinsic gate to source capacitance F Intrinsic gate to drain capacitance F Intrinsic ... bulk capacitance F pn junction depletion capacitance F/cm2 Gate oxide capacitance per unit area F/cm2 Total gate oxide capacitance (C, ,WL) F Space charge capacitance per unit area F/cm Interface ... definition is the free electron (or hole) concentration in intrinsic silicon, often called the intrinsic carrier concentration. Effective Mass of Electron and Hole. The electrons in the conduction...
... F/cm Gate to bulk overlap capacitance per unit length F/cm Intrinsic gate to source capacitance F Intrinsic gate to drain capacitance F Intrinsic gate to bulk capacitance F pn junction ... lines and from metal lines to devices will play a significant role in the circuit response. In fact, interconnect capacitances are becoming dominant in determining the performance of VLSI circuits. ... capacitance F/cm2 Gate oxide capacitance per unit area F/cm2 Total gate oxide capacitance (C, ,WL) F Space charge capacitance per unit area F/cm Interface state density charges/cm2 Electron...
... semiconductor. This process of introducing additional carriers (excess carriers) is called carrier injection and can occur in different ways (optical, electrical, etc). Note that the injection refers ... Since in many cases, capacitance may be bias dependent, more generally we define the capacitance C of any geometry as C( V) = dQ/dV which is usually called the incremental capacitance ... junction to the incremental voltage thus results in generation of an effective capacitance Cj referred to as the transition capacitance, junction capacitance or depletion layer capacitance.2s...
... capaci- tances (CBs and CBD) plus the gate overlap capacitances (C, ,, and CGDO) are called extrinsic capacitances. These extrinsic capacitances are often called parasitic capacitances of ... “serpentine” structure. If C, is the total capacitance for structure ‘a’ and C, is the total capacitance for 27 Throughout the text, the lower case subscript for charge Q and capacitance C ... with excess minority carrier injection in the bulk region under forward bias, is modeled by another capacitance Cd,. The capacitance C, , is called difusion capacitance, because the minority...
... overlap capacitances are shown as C, ,,, C, ,, and C, ,,. The twelve intrinsic capacitances are shown as CGS, CGD, C, ,, C, ,, CB,, C, ,, C, ,, C, ,, C, ,, C, ,, CDG, C, ,. These nonlinear and ... nonlinear reciprocal capacitances C, ,, C, , and CGB are normally considered as was discussed in section 3.2. However, this simple model is inadequate for many circuits as discussed in chapter ... Process Technology (N. G. Einspruch, Ed.), VLSI Electronics: Microstructure Science, Vol. 19, Academic Press Inc., New York, 1989. [25] J. Y. Chen, ‘CMOS Devices and Technologyfor VLSI’,...
... oxide. Consequently the silicon capacitance C, decreases and according to Eq. (4.61) the total capacitance decreases resulting in the following expression for the capaci- 4.4 Deviation from ... curve outwardly to the left (curve B) in accordance with Eq. (4.12). in this case the C- V curve shows a maximum negative shift in accumulation, gradually changing to almost no shift in inversion. ... thereby forming a conducting channel at the surface from the source to the drain. It must be emphasized that the formation of a conducting channel is not an abrupt process in which the channel...
... example, conflicts with the scaling rule (cf. section 3.4). In fact, the choice of process or circuit parameters is a trade off between various parameters involved in device design. SPICE Implementation. ... V,, with W for a fixed L [41]. Clearly for a $xed W, V,, decreases with decreasing L, while for a $xed L decreasing W increases V,,. This reduction in V,, with decreasing ... that for channel implanted devices the slope of the V,, curve decreases as back bias increases. This change in slope can be accounted forin the V,, expression (5.14) with replacing the...
... short-channel and narrow-width effects can be neglected. The static and dynamic characteristics of a device under the influence of external fields in general can be described by the following ... polysilicon gates. While curves (a), (b) and (c) are for channel implanted devices, curve (d) is for uniformaly doped device. Although both curves (b) and (c) are for enhance- ment devices, curve ... Trans. Electron Devices, ED-33, pp. 1745-1752 (1986). [77] S. C. Jain and P. Balk, ‘A unified analytical model for drain-induced barrierlowering and drain-induced high electric field in a...
... increase with increasing Vsb, while experimental data clearly shows that ps decreases as V,, increases. In spite of this inaccuracy Eq. (6.154) has been used in circuit simulators because ... (6.108) 6.4 Piece-Wise Drain Current Model for Enhancement Devices 251 MOSFET capacitance calculations, where small error in Qb can cause large errors in the capacitances. For this reason ... the integral in Eq. (6.14) and subsequent equations for Z,,. Strictly speaking, we must include p, inside the integral for calculating the current. However, in that case the resulting current...
... (source/drain junction region) capacitances as discussed in section 3.2. Of key importance in calculating the MOSFET capacitances is an accurate description of the various charges in the device ... EXTRINSIC b PART B Fig. 7.3 Complete equivalent circuit of a MOSFET showing both extrinsic and intrinsic capacitances (Meyer model) takes place, the maximum capacitance occurs in ... device. This is in addition to steady-state current (DC) as discussed in Chapter 6. The capacitive characteristics are in fact the sum of the intrinsic (channel region) and extrinsic (source/drain...
... 12 intrinsic capaci- tances which in general are nonreciprocal. The 16 capacitances form the so called indejinite admittance matrix (IAM). Each element Cij of this capacitance matrix ... remains towards higher channel electric field as scaling continues. The increased channel electric field has caused hot-carrier effects that are becoming a limiting factor in realizing submicron ... to the remaining three terminals. Thus, a four terminal device will have 16 capacitances, including 4 self capacitances corresponding to its 4 terminals. Excluding the self capacitances, there...