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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 1 doc

... Bibliography 18 9 19 0 19 0 19 2 19 5 19 7 200 2 01 203 206 208 211 213 213 214 214 216 CHAPTER Packaging and Reliability Considerations for MEMS 217 Key Design and Packaging Considerations Wafer or Wafer-Stack ... Bibliography 17 2 17 4 17 4 17 6 18 0 18 2 18 3 18 5 18 5 18 6 18 7 CHAPTER MEM Structures and Systems in RF Applications 18 9 Signal Integrity in RF MEMS Passive Electrical Components: Capacitors and Inductors ... Attenuation Summary References Selected Bibliography 13 3 13 3 13 5 13 9 14 1 14 2 15 1 15 4 15 6 16 1 16 5 16 5 16 7 CHAPTER MEMS Applications in Life Sciences 16 9 Microfluidics for Biological Applications Pumping...

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 2 pptx

... 2. 3–3 .2 5.5 450 1,035 1. 42 75 — 340 — 27 5 — 2. 5 — 8.4 14 21 >1 .2 16 15.4 0 .23 0.06 0 .22 2. 4 2. 6 0.17 2. 2 0.55 0 .25 3.1 2. 8 0.16 2. 65 0.55 0.14 3 .2 4 .2 0.10 3.5 1.0 5.3 5.9 0.31 3 .26 4.0 0.31 3. 62 ... tracking, and environmental and security surveillance Weapons safing, arming, and fusing Integrated microoptomechanical components for identify-friend-or-foe systems Head- and night-display systems ... http://www.darpa.mil [2] System Planning Corporation, “Microelectromechanical Systems (MEMS) : An SPC Market Study,” January 1999, 1 429 North Quincy Street, Arlington, VA 22 207 [3] Frost and Sullivan, “World...

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 3 pps

... Polyvinylidene-fluoride (PVDF) LiNbO3 BaTiO3 PZT zinc oxide (ZnO) Piezoelectric Constant (dijj) −12 (10 C/N) d 33 = 2 .31 d31 = 23 d 33 = 33 d31 =−4, d 33 = 23 d31 = 78, d 33 = 190 d31 = −171 d 33 = 37 0 d31 ... [9] Zorman, C A., and M Mehregany, “Materials for Microelectromechanical Systems,” in The MEMS Handbook, Chapter 15, M Gad-el-Hak (ed.), Boca Raton, FL: CRC Press, 2002 [10] Zhang, Z L., and N ... gold-cadmium alloy in 1951 but was quickly extended to a broad range of other alloys, including titanium-nickel, copper-aluminum-nickel, iron-nickel and iron-platinum alloys A basic understanding...

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 4 pptx

... For uniform and void-free bonding, the surfaces must be free of particles and chemical contamination, flat to within about µm across a 100-mm wafer, and smoother than about 0. 5- to 1-nm RMS roughness ... cavities, self-limiting pyramidal and V-shaped pits, and thin membranes; and (b) etching from both sides of the wafer can yield a multitude of different shapes including hourglass-shaped and oblique ... available today from many vendors The concept was quickly extended to the manufacture of pressure sensors [18] and accelerometers in the late 1980s and is now an important technique in the MEMS toolbox...

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 5 doc

... Benecke, and P Lange, “TMAHW Etchants for Silicon Micromachining,” Proc 1991 Int Conf on Solid-State Sensors and Actuators, San Francisco, CA, June 24–27, 1991, pp 8 15 818 [9] Ammar, E S., and T ... Fusion Bonding and Deep Reactive Ion Etching; A New Technology for Microstructures,” Proc 8th Int Conf on Solid-State Sensors and Actuators, Stockholm, Sweden, June 25 29, 19 95, pp 55 6 55 9 [37] Shaw, ... structural polysilicon is sufficient to make many useful devices, and up to five polysilicon and five oxide layers are a standard process at Sandia National Laboratories of Albuquerque, New Mexico...

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 6 pptx

... bottom handle wafer Silicon-fusion bonding of a p-type top wafer with an n-type epixatial layer encapsulates and seals the cavity Electrochemical etching or standard polishing thins down the top ... Minnesota, and [ 16] .) 96 MEM Structures and Systems in Industrial and Automotive Applications because it can be deposited under low tensile stress, and it retains its structural integrity in most anisotropic ... some first-order error terms Compensation and correction 92 MEM Structures and Systems in Industrial and Automotive Applications Insulator N-type epitaxial layer Deposit insulator P-type substrate...

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 7 pot

... Hz )]; bandwidth (Hz); resolution (º/s); and dynamic range (dB), the latter two being functions of noise and bandwidth Short- and long-term drift of the output, known as bias drift, is another ... and Systems in Industrial and Automotive Applications Electrostatic drive and sense electrodes Vibrating ring Anchor Support flexures Antinode Node Node 45° Antinode Node Antinode Primary standing ... tuning-fork structure for angular-rate sensing The Coriolis effect transfers energy from a primary flexural mode to a secondary torsional mode Sensors and Analysis Systems 1 07 small size and low...

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 8 ppt

... 85 , No 11, November 1997, pp 183 3– 185 6 130 MEM Structures and Systems in Industrial and Automotive Applications [12] Muller, R S., and K Y Lau, “Surface-Micromachined Microoptical Elements and ... “Genetic Analysis Systems: Improvements and Methods,” Tech Digest Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, June 8 11, 19 98, pp 7–10 [43] U.S Patent 6,533,366, March 18, 2003 ... deposited and patterned to provide bias and address electrodes, landing pads, and electrical interconnects to the underlying electronics Photoresist is spin deposited, exposed, developed, and hardened...

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 9 pps

... unloaded actuator on the right-hand side is equal to the mass of the loaded actuator (left-hand side) and the mirror Externally applied in-plane accelerations cause equal but opposite torques on ... as the C-Band) and 1,570 nm to 1,610 nm (known as the L-Band) The International Telecommunication Union (ITU) of Geneva, Switzerland, has specified the use to be on a grid of discrete channels ... voltages to the micromirror to maximize optical coupling and offset any mechanical misalignment An intentional misalignment of the micromirror angle can attenuate the coupled power into the fiber and...

An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 10 potx

... 310 317 [10] Jerman, H., and J D Grade, “A Mechanically-Balanced, DRIE Rotary Actuator for a High-Power Tunable Laser,” Tech Digest Solid-State Sensor and Actuator Workshop, Hilton Head Island, ... products, it remains an enabling technology and a means to an end It is imperative to understand the final application in order to assess the importance and applicability of MEMS for that particular application ... 1999 MacDonald, L W., and A C Lowe (eds.), Display Systems: Design and Applications, West Sussex, England: Wiley, 1997 Micromechanics and MEMS: Classic and Seminal Papers to 1990, W Trimmer (ed.),...

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