... Young's modulus, 5 TCR, 5 mean free path of electron, 5 melting point, 5 thermal conductivity, 5 Corrosion, 2, 22 encapsulated silver films, 22 H 2 S ambient, 29 Cu(Ti) alloys, 21 ... 50, 52 van der Pauw, 70 Gold, 98, 101 H 2 S ambient, 24 Heat of formation, 93 Hillocks, 69, 75–81, 117, 118 Hole formation, 69 Hydrogen sulfide, 24 H 2 S ambient, 24 , 25 , 28 , 29 ... Nguyen, J. D. Hensen, T. L. Alford, Mater. Lett. 45, 157 (20 00). [17] D. Adams, T. L. Alford, Materials Science and Engineering R 40, 20 7 (20 03). Index Adhesion analysis, 54...