Revision Date: Nov. 28, 2008 Rev.1.01 REJ27L0001-0101 Semiconductor Reliability Handbook Handbook The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. Rev. 1.01 Nov. 28, 2008 Page ii of xviii REJ27L0001-0101 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. 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You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products. Renesas shall have no liability for damages arising out of such detachment. 12. 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Notes regarding these materials Rev. 1.01 Nov. 28, 2008 Page iii of xviii REJ27L0001-0101 Main Revisions for This Edition Item Page Revision (See Manual for Details) 6.1.2 Derating Table 6.3 Humidity Derating Characteristics (Example) 226 Table amended Example of Derating Application Humidity Derating Stress factor Temperature, relative humidit y Failure judgment criterion Deterioration of electrical characterist ics Failure mechanism Metallization corros ion Saturation vapor pressure (KPa) table (based on Wagner's formula) Temperature ( ° C) 0 10 20 30 40 50 60 70 80 90 100 110 120 130 0 0.611 1.228 2.340 4.248 7.385 12.35 19.94 31.18 47.39 70.14 101.3 143.3 198.6 270.3 2 0.706 1.403 2.646 4.761 8.210 13.62 21.85 33.98 51.36 75.64 108.8 153.2 211.5 286.8 4 0.814 1.599 2.987 5.326 9.112 15.01 23.93 36.99 55.60 81.50 116.7 163.7 225.1 304.2 6 0.935 1.819 3.365 5.949 10.09 16.52 26.17 40.21 60.14 87.73 125.1 174.7 239.4 322.5 8 1.073 2.065 3.784 6.634 11.17 18.16 28.58 43.68 64.98 94.35 133.9 186.3 254.5 341.6 Outline Since metallization corrosion is accelerated (due to supply of moisture) at the saturation vapor pressure, it is considered to be a stress that controls the failure rate caused by this mechanism. In this model the service life is approximated by the nth power of this stress. Service life = constant × (saturation vapor pressure) -n Taking the logarithms of both sides of this equation, we obtain: log (service life) = -n × log (saturation vapor pressure) + (constant) Taking the logarithm of saturation vapor pressure as the abscissa and the logarithm of the time required to reach the prescribed failure rate at that vapor pressure (service life) as the ordinate, the resulting graph is approximately a straight line. Relative humidity expresses the humidity at a given temperature relative to the saturation vapor pressure, which is 100%. It can be determined using the following equation: Vapor pressure = saturation vapor pressure × relative humidity How to calculate derating We calculate the acceleration under typical conditions used in tests of ability to withstand humidity (65°C/95% RH) and typical conditions in the marketplace (Ta = 25°C/65% RH). From the table, the saturation vapor pressure at 65°C is calculated by the interpolation method to be 25.05 KPa and the saturation vapor pressure at 25°C is calculated to be 3.176 KPa. The vapor pressure is calculated by multiplying these values by 0.95 and 0.65, respectively. Taking the ratio and using the typical acceleration constant n = 2, acceleration (α) can be calculated as follows: The result is thus 133 time s α = (23.80 / 2.064 ) 2 = 133 Rev. 1.01 Nov. 28, 2008 Page iv of xviii REJ27L0001-0101 All trademarks and registered trademarks are the property of their respective owners. Rev. 1.01 Nov. 28, 2008 Page v of xviii REJ27L0001-0101 Contents Section 1 Quality Assurance 1 1.1 Renesas' Approach to Quality Assurance 1 1.2 Quality Assurance System for Semiconductor Devices 1 1.3 Quality Assurance at Development Stage 4 1.4 Quality Assurance at Mass Production Stage 6 1.5 Change Control 9 1.6 Product Identification and Traceability 10 1.7 Failure After Shipping and Corrective Actions 12 1.8 Quality Assurance for Materials And Parts 13 1.9 Environmentally-Friendly Design 15 1.9.1 Expansion of Green Procurement 16 1.9.2 Reduction of Environmental Impact in the New Product Development Stage (Product Environment Assessment) 16 1.9.3 Management of Chemical Substances 17 Section 2 Reliability 19 2.1 Failure rate function 19 2.2 Dependencies of failure rate function 20 2.2.1 Initial Failures 22 2.2.2 Random Failures 22 2.2.3 Wear-out Failures 23 2.3 Screening 23 2.4 Forecasting Lifetime 25 2.5 Properties of Semiconductor Reliability 26 2.6 Reliability Criteria 28 2.6.1 Initial Failure Period Criteria 28 2.6.2 Random Failure Period Criteria 29 Section 3 Reliability Testing and Reliability Prediction 35 3.1 What Is Reliability Testing 35 3.2 Reliability Test Methods 37 3.3 Accelerated Lifetime Test Methods 44 3.3.1 Fundamental Failure Model 44 3.3.2 Method of Accelerated Life Testing 49 3.3.3 Analysis of Test Results 52 3.3.4 Procedure for Failure Rate Prediction With 60% Confidence Level 63 Rev. 1.01 Nov. 28, 2008 Page vi of xviii REJ27L0001-0101 3.4 Reliability Prediction Based on the Failure Mechanism 64 3.4.1 Example of Predicting the Initial Failure Rate (Initial Failures from Oxide Film Breakdown) 65 3.4.2 Example of Predicting the Random Failure Rate (Method of Estimating a Failure Rate at a 60% Reliability Level) 67 3.4.3 Predicting Wear-Out Failures 80 3.4.4 Future Product Life 80 Section 4 Failure Mechanisms 83 4.1 Failure Classification 83 4.2 Failure Mechanisms related to the Wafer Process 89 4.2.1 Time Dependent Dielectric Breakdown 90 4.2.2 Hot Carrier 93 4.2.3 NBTI (Negative Bias Temperature Instability) 97 4.2.4 Electromigration 99 4.2.5 Stress Migration 101 4.2.6 Soft Error 102 4.2.7 Reliability of Non-Volatile Memory 106 4.3 Failure Mechanisms related to the Assembly Process 110 4.3.1 Wire Bonding Reliability (Au-Al Joint Reliability) 110 4.3.2 Ag Ion Migration 114 4.3.3 Cu Ion Migration 117 4.3.4 Al Sliding 119 4.3.5 Mechanism of Filler-Induced Failure 121 4.3.6 Whiskers 123 4.3.7 Moisture Resistance of Resin Mold Semiconductor Devices 124 4.4 Failure Mechanisms related to the Mounting Process and During Practical Use 131 4.4.1 Cracks of the Surface-Mounted Packages in Reflow or Flow Soldering 131 4.5 Mechanism of Failures Related to Handling 145 4.5.1 Electrostatic Discharge 145 4.5.2 Latchup 161 4.5.3 Power MOS FET Damage 164 Section 5 Failure Analysis 173 5.1 Why Failure Analysis Is Necessary? 173 5.2 What Is Failure Analysis? 173 5.3 Procedure of Failure Analysis 174 5.3.1 Investigation of Failure Circumstances 174 5.3.2 Preservation of Failed Devices 175 5.3.3 Visual Inspection 176 Rev. 1.01 Nov. 28, 2008 Page vii of xviii REJ27L0001-0101 5.3.4 Evaluation for Electrical Characteristics 178 5.3.5 Internal Analysis of a Package 181 5.3.6 Locating Failure Points In A Chip 183 5.3.7 Physical Analysis 201 5.3.8 Establishment of Failure Mechanism 209 5.3.9 Appendix (List of Analysis Techniques) 210 Section 6 Usage Precautions 221 6.1 Device Selection 221 6.1.1 Maximum Ratings 221 6.1.2 Derating 222 6.1.3 Using a Device with Equivalent Function 230 6.1.4 When a Device is Used in a Severe Environment 233 6.1.5 When Using a Device in an Application that Requires High Reliability 233 6.2 Preventing Electrostatic Discharge (ESD) Damage 235 6.2.1 ESD Damage 235 6.2.2 Latchup 251 6.3 Preventing Mechanical Damage 255 6.3.1 Lead Forming and Cutting 255 6.3.2 Mounting on a Printed Circuit Board 260 6.3.3 Flux Cleaning Methods 264 6.3.4 Attachment of the Heat-Sink Plate 267 6.4 Preventing Thermal Damage 277 6.4.1 Soldering Temperature Profile 277 6.4.2 Precautions in Handling a Surface-Mount Device 280 6.4.3 Using Reflow to Attach Surface-Mount Devices 282 6.4.4 Recommended Conditions for Various Methods of Mounting Surface-Mount Devices 282 6.5 Preventing Malfunction 286 6.5.1 Precautions with Respect to Hardware 286 6.5.2 Precautions in Circuit Design 286 6.5.3 Precautions for Board Mounting 289 6.5.4 Precautions against Malfunction due to Noise 293 6.5.5 Precautions on Signal Waveforms 296 6.5.6 Precautions with Regard to the Environmental Conditions in which the Device is Used 300 6.6 Software Precautions 302 6.7 Being Prepared for Possible Malfunction 303 6.8 Failure-Detection Ratio during Test 305 6.9 Precautions in Packaging 310 Rev. 1.01 Nov. 28, 2008 Page viii of xviii REJ27L0001-0101 6.10 Storage Precautions 313 6.11 Precautions in Transport 317 6.12 Product Safety 318 6.13 Examples of Other Categories of Problems 320 Section 7 Standards and Certification Schemes for the Quality System, Safety, and Reliability of Semiconductor Devices 325 7.1 Quality System Standards 325 7.1.1 Overview of the ISO 9000 Series 325 7.1.2 ISO 9000 Family Standards (Standards of the Year 2000) 325 7.1.3 Registration Systems for the ISO 9000 Series 326 7.2 Safety-Related Standards 327 7.2.1 Introduction 327 7.2.2 CE Marking System 328 7.3 Reliability-Related Standards 329 7.3.1 Introduction 329 7.3.2 JIS Standards 329 7.3.3 JEITA (EIAJ) Standards 329 7.3.4 JEDEC Standards 330 7.3.5 IEC Standards 330 7.3.6 CECC Standards 331 7.3.7 MIL Standards 331 7.4 Certification Systems 332 7.4.1 Mutual Relationships of Certification Systems in the World 332 7.4.2 Reliability Certification Systems for Semiconductor Devices 333 Appendix 345 A. Attached Tables 345 A.1 AQL Sampling Table (SOURCE: JIS Z 9015) 345 A.2 LTPD Sampling Table (Source: MIL-S-19500, sampling inspection tables) 349 A.3 Probability Density of Normal Distribution 351 A.4 Upper Probability of Normal Distribution 353 A.5 Percent Points of Normal Distribution 356 A.6 Poisson Distribution (Probability) 359 A.7 Vibration Tables (Amplitude, Velocity, and Acceleration vs. Frequency) 370 A.8 Water Vapor Pressure Tables 371 B. Reliability Theory 373 B.1 Reliability Criteria 373 B.2 Reliability of Composite Devices 378 B.3 Failure Models for Accelerated Life Testing 382 Rev. 1.01 Nov. 28, 2008 Page ix of xviii REJ27L0001-0101 B.4 Probability Models Used in Reliability Analysis 387 C. Relations of Probability Distributions 408 D. Probability Functions 409 Rev. 1.01 Nov. 28, 2008 Page x of xviii REJ27L0001-0101 [...]... for the Quality System, Safety, and Reliability of Semiconductor Devices Table 7.1 Major Standards for Reliability and Quality Management of Semiconductor Devices And ICs 334 Appendix Table A.1 AQL Sampling Table 346 Rev 1.01 Nov 28, 2008 Page xviii of xviii REJ27L0001-0101 Section 1 Quality Assurance Section 1 Quality Assurance 1.1 Renesas' Approach to Quality Assurance Renesas. .. engineering, Renesas provides a comprehensive quality assurance/management program that covers all product stages from planning to after-sales servicing Renesas' focus is on ensuring and improving quality and reliability To achieve our goal, we enforce quality control at three levels: design, production, and finished product Quality first: This is how every Renesas employee strives to satisfy customers 1.2 Quality. .. have Renesas products been manufactured with high reliability and then improved for higher reliability by the quality assurance system illustrated in figure 1.2, but they also they have been specified from the product development stage for an appropriate degree of reliability based on the classification in table 1.1 Table 1.1 Quality Levels Quality Level Description Typical Product Applications High reliability. .. management Production quality control and improvement Development and prototyping Design Quality data analysis Improvement of yields Building in reliability Product quality control and TQM promotion Failure physics Testing/ inspection Customer Customer support Customer complaints Information from the field Information delivery Figure 1.1 Renesas Quality Assurance System for Semiconductor Devices Quality control... and materials control Quality management system Change control Design verification Design of packaging structures for devices Environmental control Quality approval system In-process management Reliability engineering Activity Verification of defined product quality Production process Quality and reliability improvement Failure Data analysis collection Flow of direction Periodic reliability testing Warehousing... management of quality control information as an integral part of the Renesas total quality control system Rev 1.01 Nov 28, 2008 Page 2 of 410 REJ27L0001-0101 Section 1 Quality Assurance Quality control in the finished product stage has two aspects The first is in-house testing and inspection by device, by lot, or of samples to determine if products have met the prescribed functionality and reliability. .. Devices Figure 1.1 outlines our quality assurance system, which embraces the life cycle of a product from development and design to mass production to shipment and field use Rev 1.01 Nov 28, 2008 Page 1 of 410 REJ27L0001-0101 Section 1 Quality Assurance Total quality assurance system Characteristics and quality verification in design Quality control in production Process control Reliability design Design... levels above and set with different reliability* standards) Note: * 1.3 Designed under a separate contract Quality Assurance at Development Stage We use the following procedure to ensure the target quality and reliability in product development Using the demand estimate based on market research, we plan development considering the required levels of quality, functionality, reliability and production issues... passes the reliability test, a pre-production meeting is held to check for any problems related to design, production, and quality If no problems are found, the prototype goes to the pre-production stage Each development level has a specific quality check and approval flow The steps for Level I, for example, are usually performed as follows To help ensure the desired quality and reliability, quality certification,... Collection of quality data for materials and parts, and control of abnormalities • Change control for materials and parts • Regular quality assurance surveys on suppliers, and quality meetings with them Rev 1.01 Nov 28, 2008 Page 13 of 410 REJ27L0001-0101 Section 1 Quality Assurance Figure 1.8 shows the relationship between these activities Renesas Technology Corp Supplier Supplier Approval Quality assurance . Section 1 Quality Assurance 1 1.1 Renesas& apos; Approach to Quality Assurance 1 1.2 Quality Assurance System for Semiconductor Devices 1 1.3 Quality Assurance. defined product quality Characteristics and quality verification in design Figure 1.1 Renesas Quality Assurance System for Semiconductor Devices Quality control