Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis 3 ppt
Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis_3 ppt
... impedance matching.FIGURE 3. 12: Measured and simulated input resistance and reactance of the inkjet-printed RFID tag. THREE- DIMENSIONAL PACKAGING IN MULTILAYER ORGANIC SUBSTRATES 23 As a benchmark ... is measured in open air. (Case 2) The packaging layer is broughtdown and taped into hard contact and measured. (Case 3) A top metal press plate and a 15 lbwt are puton top of the packaging layer ... become a commonly used material in 3D integration and packaging of the future, due to its ultra-low cost, ease of multilayer lamination in very low temperatures (∼150◦C) and it enevironmentally-friendly...
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Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis_4 docx
... 4.9(b). k 23 and d 23 are determined in the same way as k12 and d12since theinvestigated filter is symmetrical around its center.Figure 4.10 shows the comparison of the simulated and the measured ... approximately 37 9 m. Additional miniaturization islimited by the minimum distance [LS in Fig. 4.1(b)] between the corners of adjacent orthogonalcuts. Meanwhile, as the operating frequency decreases, ... exhibits a center frequency of 59.15 GHz, anFIGURE 4.11: Measured and simulated S-parameters of five-pole slotted patch bandpass filter. 34 THREE- DIMENSIONAL INTEGRATION insertion loss of about 1 .39 ...
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Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis_5 docx
... fine-tuned after considering the minimum and maximum of the fabrica-tion tolerances. Then, the final values that match the desired frequency response can be determined.To allow the wafer characteriz ation ... resonant frequency according to the guidelines specified in Section 5.1. In the presentedexample, the minimum value of center-to-center vias spacing (p =39 0 m) and the minimum valueof via diameter ... 0.5 mm (fivesubstrate layers) to achieve a higher Qu and consequently to obtain narrower bandwidth. The cavityresonator with 0.5 mm height has been fabricated in LTCC and measured. The comparison...
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Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis_7 ppt
... +90◦+90◦Result In phase In phase68 THREE- DIMENSIONAL INTEGRATION metal 1metal 2metal 3 metal 4metal 5metal 6LWHsubstrate 1substrate 2substrate 3 substrate 4substrate 5substrate 6-10 (a) (b)(c) ... structures. Also, the intercouplings, M 13 and M 32 ,are determined by the size and position of the intercoupling slots and dominated by themagnetic coupling. It is worth noting that M 13 is different ... 6-10 (a) (b)(c) (d)microstrip feedlineexternal slotvia wallsvia wallsmetal 1metal 2substrate 1substrate 2metal 3 substrate 3 metal 4metal 5metal 6substrate 4substrate 5substrate 6-10microstrip...
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Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis_8 ppt
... sur face is near 9 dBi, about 3 dBhigher than the maximum gain and 7 dB higher than the gain at broadside for the antenna withoutthe soft surface.6.2 HIGH-GAIN PATCH ANTENNA USING A COMBINATIONOF ... patch antenna forms an antenna array in the E-plane. Theformed array acts as a broadside array with minimum radiation in the x-y plane when the distancebetween the inner edge of the soft surface ... simulations demonstrated that the maximum cross-polarizationmay happen in the plane =45◦or = 135 ◦. During measurement, a slight deviation from theideal planes can cause a considerable...
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Three Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging by Jong Hoon Lee Emmanuil Manos M Tentzeris and Constantine A Balanis_10 pot
... RF and Wireless Applications using ceramic and organicflexible materials, paper-based RFID’s and sensors, Microwave MEM’s, SOP-integrated (UWB,mutliband, conformal) antennas and Adaptive Numerical ... Thompson, S. Pinel, R. L. Li, J. H. Lee, G. DeJean, S. Sarkar, R. Pratap, R. Bairavasubramanian, and N. Papageorgiou, RF SOPfor multi-band RF and millimeter-wave systems,” Advanced Packaging Magazine, ... Pinel, M. Davis, A. Rhagavan, M. Maeng, S. -W. Yoon, and R. Tummala, “Advanced system-on-package RF front-ends for emerging wireless com-munications,” in Proc. 2002 Asian-Pacific Microwave Symposium,...
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Leap! a revolution in creative business (2003)
... from my HCM days) and its New Yorkagency Della Femina McNamee, and became Messner Vetere BergerMcNamee Schmetterer (MVBMS) Euro RSCG. A couple of yearslater I was asked to become chairman and ... LEFT-BRAIN/RIGHT-BRAIN THINKERhate innovation; creativity is my enemy.” Why? Because we areagainst mistakes, we are against failure, and it is hard to have creativ-ity and innovation without mistakes and failure.NO ... some straightforward ads and mediaplans.” No one. Ever. They want creativity in all its forms: in data-based direct marketing, interactive marketing, and sales promotion aswell as advertising....
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A Revolution in Creative Business Strategy Bob Schmetterer docx
... airtime, and media attention. Morethan any ad campaign.Building a city landmark instead of creating a bunch of ads and putting together a media buy? That is creative business thinking at a higher ... idea of building the Disney brand. And a theme park was a way to create a brand experience. An amazing leap? A huge gamble?Absolutely.Back then, Americans viewed amusement parks as seedy and low ... creativity in all its forms: in data-based direct marketing, interactive marketing, and sales promotion aswell as advertising. They want it in all communications and in theiroverall business....
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Báo cáo khoa học: cGMP and glutathione-conjugate transport in human erythrocytes The roles of the multidrug resistance-associated proteins, MRP1, MRP4 and MRP5 pot
... 733 – 738 .22.Twentyman,P.R.,Fox,N.E.,Wright,K .A. &Bleehen,N .M. (1986) Derivation and preliminary characterization of adriamycinresistant lines of human lung cancer cells. Br.J.Cancer 53, 529– 537 . 23. Barrand, M .A. , Heppell-Parton, A. C., ... and COR-L 23/ R cells, and crudelysates from MOR/ADR cells were size fractionated on 7.5% SDS/PAGE, blotted and immunostained with (A) M 5I-1 mAb, and (B) anti-MRP4 mAb, detecting MRP5 and MRP4, ... of 3. 3 l M [ 3 H]cGMP at 37 °C into inside-out erythrocyte membrane vesicles wasapproximately constant for more than 30 min at about10pmolÆmg)1Æmin)1(Fig. 1A) . Uptake of [ 3 H]cGMP in theabsence...
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Effect of periodic suction on three dimensional flow and heat transfer past a vertical porous plate embedded in a porous medium
... plate. Yamamoto and Iwamura [4], Raptis [5], Raptis et al. [6], Govindarajulu and Thangaraj [7] and Mansutti and his associates [8] investigated the free convective flow of viscous fluids along ... unsteady MHD convective heat transfer past a semi-infinite vertical porous moving plate with variable suction was investigated by Kim [11]. Singh and Sharma [12] analyzed the three dimensional ... flow and heat transfer through a porous medium with periodic permeability. Chauhan and Sahal [ 13] analyzed the flow and heat transfer over a naturally permeable bed of very small permeability...
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