References cited in this section 33. M. Gupta and D.W. Hoch, Phenolic Sheer Molding Compounds, 31st International SAMPE Symposium, 1986, Society for the Advancement of Material and Process Engineering, p 1486 34. K. Fisher, Fabricating with Chopped Carbon Composites, High-Perform. Compos., Vol 5 (No. 1), 1997, p 23 Phenolic Resins Shahid P. Qureshi, Georgia-Pacific Resins, Inc. Phenolics for Hand Lay-Up The hand lay-up or wet lay-up process is widely used for making composites with chopped strand mat and polyester resins. Resin requirements are a viscosity of 0.5–2.0 Pa · s (500–2000 cP), 10–60 min pot life for resin/catalyst mixture, and 60–80 °C (140–175 °F) cure temperature. Due to the market demand, phenolic technology was advanced to achieve polyester-like processing, mechanical properties (Table 10), pot life, and cure speed. Table 10 Properties of phenolic and polyester hand lay-up composites Property Phenolic Polyester Flexural strength, MPa (ksi) 225 (32.6) 235 (34.1) Flexural modulus, GPa (10 6 psi) 12.4 (1.8) 9.7 (1.4) Waterborne phenolic resole resins with sulfonic acid and phosphate ester catalyst are used for hand lay-up processes. The latent phosphate ester (Ref 27) or phosphonic acid (Ref 28), in conjunction with p-toluene sulfonic acid, was effective in meeting pot life and cure speed requirements of the hand lay-up process. Due to the condensation cure and solvent loss, phenolic laminates are more porous than polyester laminates. This shortcoming is addressed using a phenolic-based surface coat. A thixotropic phenolic-based surface paste is available. The paste is brushed or sprayed on the mold and allowed to partially cure before the glass is applied and the hand lay-up process is completed. The surface paste-coated panels are then subjected to the desired paint color. This is a three-step process, compared to the two-step process of lay-up and gel coating for polyester laminates; fabricators have requested a pigmentable phenolic-compatible gel coat to eliminate the painting step. Recently, acrylic gel coats that show good adhesion to the phenolic composite substrate have been introduced. Developmental work continues to meet the needs of the mass transit industry with phenolics. In Europe, hand lay-up phenolic composites have been used in mass transit since 1988, after a fire broke out at the King's Cross Station, which killed thirty-one people and injured several hundred others. In response to this tragedy, the British government established a Code of Practice (BS 6853) that includes flame spread and smoke limitations for composites used in underground railways. Phenolic composites from Georgia-Pacific and Borden Cellobond products are the only composites that meet the code requirement (Ref 22). Most of the underground railways in France and the Scandinavian countries have followed the specifications of the United Kingdom and switched to phenolic composites. For mass transit applications in the United States, the current flame spread index requirements (less than 35, per ASTM E 162) and smoke emission specifications (smoke density at 4 min less than 200) for passenger rail vehicles can be met with fiber-reinforced polyesters and vinyl esters. However, with an increasing awareness for reducing fire hazards and improving passenger safety, the United States may follow the example of Britain. If the smoke specification requirement is reduced to less than 20, the use of phenolics will be required (Ref 35). Recently, phenolic hand lay-up, latent-acid- cure technology has been used to manufacture large (1.8 by 5.4 m, or 6 by 18 ft) panels for constructing composite homes. American Structural Composites (Reno, NV) demonstrated the advantages of phenolic composite homes compared with homes built with traditional construction materials. The phenolic panels eliminate the possibility of termite damage and provide better fire safety and easier construction (Ref 36). References cited in this section 22. C. King and J.R. Zingaro, “Phenolic Composites in the Aircraft Industry and the Necessary Transition to the Mass Transit Rail Industry,” paper presented at the 51st Annual Conf., Composites Institute, Society of the Plastics Industry Inc., 1996 27. Process for Hardening Phenolic Resins, Patent EP 0539098, 1 July 1998 28. Thermosetting Phenolic Resin Composition, U.S. Patent 864,003, Jan 1999 35. “The Mass Transit Market Place,” The Society of the Plastics Industry, Winter 1996 36. D.O. Carlson, Automated Fiberglass Composite Wall Panel Plant is Developing Housing's Future, Automated Builder, Feb 2000, p 8 Phenolic Resins Shahid P. Qureshi, Georgia-Pacific Resins, Inc. Conclusions In the 1990s, phenolic resin technology advanced to meet the processing requirements of state-of-the-art composites fabrication processes. Phenolic resin composites offer superior fire resistance, excellent high- temperature performance, long-term durability, and resistance in hydrocarbon and chlorinated solvents. These benefits are available at no additional cost, compared to other thermosetting resins. Mechanical properties of the composite depend on the fabrication process, resin content, and fiber configuration. Fire safety attributes are less sensitive to these variables; they are more a function of the resin/fiber ratio. In recent years, the technology improvements in phenolic resins include the development of low-emission resins, latent acids for desired pot life/cure temperature, and modifiers for higher strength. Application of phenolic composites continues to increase where fire safety is a primary requirement. Phenolic Resins Shahid P. Qureshi, Georgia-Pacific Resins, Inc. References 1. A. Gardziella, L.A. Pilato, and A. Knop, Phenolic Resins Chemistry, Applications, Standardization, Safety and Ecology, Springer-Verlag, 1999 2. T.H. Dailey, Jr. and J. Shuff, “Phenolic Resins Enhance Public Safety by Reducing Smoke, Fire and Toxicity in Composites,” paper presented at the 46th Annual Conf., Composites Institute, 18–21 Feb 1991, Society of the Plastics Industry Inc. 3. U. Sorathia, T. Dapp, and C. Beck, Fire Performance of Composites, Mater. Eng., Sept 1992, p 10 4. “High Temperature Graphite Phenolic Composites,” NASA Tech Briefs MFS 28795, Technical Support Package, George C. Marshall Space Flight Center, 1994 5. A. Mekjian and S.P. Qureshi, “Phenolic Resins Technology,” paper presented at the Composites Fabricator Association Annual Convention, 18–21 Oct 1995 6. H. Gupta and M. McCabe, “Advanced Phenolic Systems for Aircraft Interior,” paper presented at the FAA International Conf. for the Promotion of Advanced Fire Resistant Aircraft Interior Materials (Atlantic City, NJ), 9–11 Feb 1993 7. K.L. Forsdyke, “Phenolic Matrix Resins: The Way to Safer Reinforced Plastics,” paper presented at the 46th Annual Conf., Composite Institute, 18–21 Feb 1991, Society of the Plastics Industry Inc. 8. S.F. Trevor, “Fire Hard Composites,” tutorial seminar presented at the 40th SAMPE Symposium, 8–11 May 1995 9. A. Mekjian, “Phenolic RTM: A Boon to Mass Transit,” paper presented at the 49th Annual Conf.: Session 2-B, Composite Institute, Society of the Plastics Industry Inc., 1994 10. S.P. Qureshi, “High Performance Phenolic Pultrusion Resin,” paper presented at the 51st Annual Conf., Composites Institute, Society of the Plastics Industry Inc., 1996 11. J.L. Folker and R.S. Friedrich, High Performance Modified-Phenolic Piping System, Proc. International Composites Expo '97 (Nashville, TN), Session 22A, 1998 12. K. Namaguchi, “Phenolic Composites in Japan,” a database of the American Chemical Society, paper presented at the 54thAnnual Conf., Composites Institute, Society of Plastics Industry Inc., 1999 13. J.G. Taylor, Phenolic Resin Systems for Pultrusion, Filament Winding and Other Composite Fabrication Methods, 44th International SAMPE Symposium, Society for the Advancement of Material and Process Engineering, 23–27 May 1999, p 1123 14. “Dura Grid Phenolic Grating,” product bulletin, Strongwell, Bristol, VA, 1996 15. G. Walton, Manufacturers Tackle Phenolic Processing Challenges, High-Perform. Compos., Jan/Feb 1998 16. D.L. Schmidt, K.E. Davidson, and L.S. Theibert, SAMPE J., Vol 32 (No. 4), 1996 p 44 17. S.P. Qureshi and R.A. McDonald, Low Emission, Water-Borne Phenolics for Prepregs and Honeycomb Applications, 37th International SAMPE Tech. Conf., Vol 39,Society for the Advancement of Material and Process Engineering, 1994, p 1023 18. S.P. Qureshi, “Fire Resistance and Mechanical Properties for Phenolic Prepregs,” paper presented at the FAA International Conf. (Atlantic City, NJ), 9–11 Feb 1993 19. G. Lubin, Handbook of Composites, Van Nostrand Reinhold Company, New York, NY, 1982, p 146, 154 20. A. Butcher, L.A. Pilato and M.W. Klett, Environmentally and User Friendly Phenolic Resin for Pultrusion, International SAMPE Tech. Conf., Vol 29, Society for the Advancement of Material and Process Engineering, 1997, p 635 21. K. Jellinek, B. Meier, and J. Zehrfeld, Bakelite Patent EP 0242512, 1987 22. C. King and J.R. Zingaro, “Phenolic Composites in the Aircraft Industry and the Necessary Transition to the Mass Transit Rail Industry,” paper presented at the 51st Annual Conf., Composites Institute, Society of the Plastics Industry Inc., 1996 23. J.F. Mayfield and J.G. Taylor, “Advanced Phenolic Pultruded Grating for Fire Retardant Applications,”31st International SAMPE Tech. Conf., 26–30 Oct 1999, Society for the Advancement of Material and Process Engineering, p 142 24. H D. Wu, M S. Lee, Y D. Wu, Y F. Su, and C C. Ma, “Pultruded Fiber-Reinforced Polyurethane- Toughened Phenolic Resin,”J. Appl. Polym. Sci., Vol 62, 1996, p 227–234 25. Product Brochure GP652D79/GP012G23 Pultrusion System, Georgia-Pacific, 2001 26. “Toughened Phenolic Resins for Pultrusion Applications,” Georgia-Pacific Resins, Inc., unpublished results, Dec 2000 27. Process for Hardening Phenolic Resins, Patent EP 0539098, 1 July 1998 28. Thermosetting Phenolic Resin Composition, U.S. Patent 864,003, Jan 1999 29. S.P. Qureshi, Recent Developments in Phenolic Resins Technology and Composites Applications, 31st International SAMPE Tech. Conf., 26–30 Oct 1999, Society for the Advancement of Material and Process Engineering, p 150 30. “Factory Mutual Approved Products for Clean Room Ducting Applications,” ATS Products, Richmond, California 31. U.S. Patent 5,202,189, 13 April 1993 32. Phenolic Resin Compositions with Improved Impact Resistance, U.S. Patent 5,736,619, 7 April 1998 33. M. Gupta and D.W. Hoch, Phenolic Sheer Molding Compounds, 31st International SAMPE Symposium, 1986, Society for the Advancement of Material and Process Engineering, p 1486 34. K. Fisher, Fabricating with Chopped Carbon Composites, High-Perform. Compos., Vol 5 (No. 1), 1997, p 23 35. “The Mass Transit Market Place,” The Society of the Plastics Industry, Winter 1996 36. D.O. Carlson, Automated Fiberglass Composite Wall Panel Plant is Developing Housing's Future, Automated Builder, Feb 2000, p 8 Cyanate Ester Resins Susan Robitaille, YLA Inc. Introduction CYANATE ESTER (CE) RESINS are a family of high-temperature thermosetting resins— more accurately named polycyanurates—that bridge the gap in thermal performance between engineering epoxy and high- temperature polyimides. In addition to their outstanding thermal performance, CE resins have several desirable characteristics that justify their higher cost in many applications. They possess a unique balance of properties and are particularly notable for their low dielectric constant and dielectric loss, low moisture absorption, low shrinkage, and low outgassing characteristics. Despite their relatively high cost they have found wide applications in electronics, printed circuit boards, satellite and aerospace structural composites, and low- dielectric and radar applications. They can be formulated for use as high-performance adhesives, syntactic foams, honeycomb, and fiber- reinforced composites and are often found in blends with other thermosetting resins such as epoxy, bismaleimide, and engineering thermoplastics (Ref 1). E. Grigat (Ref 2) first successfully synthesized aryl cyanate monomers in the early 1960s, and in 1963, a process was developed to produce the monomers commercially. In the 1970s, the first patents for CE resins were awarded to Bayer AG and Mobay. These patents focused primarily on their use in printed circuit boards (PCBs), using a bisphenol A-based prepolymer. In the late 1970s, patents were licensed to Mitsubishi Gas Chemical and Celanese. Mitsubishi marketed a CE and bismaleimide blend under the name BT resin. Both blended and 100% CE resins systems were initially targeted into the PCB industry. In the 1980s, Hi-Tech Polymers, formerly Celanese, was instrumental in the commercial development of CE resin technology by producing and characterizing a wide array of different polymer backbones with CE functionality. Dave Shimp and Steve Ising of Hi-Tech Polymers are noted for their great contribution to the applications and development of CE polymers during this period (Ref 1, 2, and 3). By the mid 1980s, work was proceeding on the development of commercial CE and CE/epoxy blends for aerospace and PCB applications. This work was undertaken because of keen interest in improving the hot/wet performance of composites for both structural composites and electronic applications. Cyanate esters were selected for development because of their excellent low moisture-absorbing characteristics and high mechanical and thermal performance. But, due to their high cost and lack of a comprehensive database, they did not penetrate into the large commercial aircraft and structural composite industry. They did, however, find acceptance for dimensionally critical applications in space structures where weight-to-stiffness trade-offs allow higher materials costs. Lower-cost CE resins and CE blends with epoxy and with bismaleimide were eventually developed and entered the electronics industry; these lower-cost resins and blends currently account for approximately 80% of CE use. Estimated CE resin use in 1999 was approximately 400,000 lb (Ref 4). References cited in this section 1. A.W. Snow, The Synthesis, Manufacture and Characterization of Cyanate Ester Monomers, Chemistry and Technology of Cyanate Ester Resins, Hamerton, 1994 2. E. Grigat and R. Putter, German Patent 1,195,764, 1963 3. D.A. Shimp, J.R. Christenson, and S.J. Ising, “Cyanate Ester Resins—Chemistry, Properties and Applications,” Technical Bulletin, Ciba, Ardsley, NY, 1991 4. B. Woo, Vantico, personal correspondence, Oct 2000 Cyanate Ester Resins Susan Robitaille, YLA Inc. Cyanate Ester Chemistry Cyanate ester resins are available as low-melt crystalline powder, liquid, and semisolid difunctional monomers and prepolymers of various molecular weights. Higher molecular weight resins are also available as solid flake or in solution. Prepolymers are formed by controlling the cyclotrimerization of monomers in an inert atmosphere, then thermally quenching the resin when it approaches the desired molecular weight. The most widely used method for commercial production of CE resins is the low-temperature reaction of a cyanogen halide, such as cyanogen chloride, with alcohol or phenol in the presence of a tertiary amine. The low reaction temperatures are desirable in order to reduce the formation of the undesirable by-product diethylcyanamide, a volatile contaminant. It is also important to fully react the phenol during the synthesis, because free, unreacted phenol will catalyze the cyclotrimerization reaction, and significantly reduce shelf life of the resin, and increase the potential for an uncontrollable exothermic reaction during heating. Due to the extreme hazard of handling and manufacturing with cyanogen halides, there are few companies in the world that are capable of producing commercial quantities of CE resins. As of 2001, Mitsubishi Gas Chemical, Lonza, and Vantico are the main suppliers of CE monomers and prepolymers. Optionally, cyanogen bromide can be used instead of cyanogen chloride. Because it is a solid, it is easier to handle safely; however, it is more likely to form diethylcyanamide by reacting more aggressively with the tertiary amine. This can be avoided by substituting potassium or sodium hydroxide for the amine or by using alcoholates directly (Ref 1). Commercially, CE resins are available in monomer and prepolymer forms with several different backbone structures. The general structure of CE resins is a bisphenol, aromatic, or cycloaliphatic backbone with generally two or more ring-forming cyanate functional groups (-O-C N-). The differences in backbone and the substituent pendent groups result in a variety of structure/property relationships. Table 1 describes the available physical forms of the monomers or prepolymers, their approximate cost, and the applications for each of the resin types. Materials suppliers formulate these basic components into proprietary systems by combining different CE resins or blending them with other thermosets or thermoplastics, or by adding catalysts, fillers, and flow and toughness modifiers. Cure, or conversion to a thermoset, occurs by cyclotrimerization of three functional groups to produce a triazine ring. The cured polymer forms a three-dimensional cross-linked network consisting of triazine rings linked to the backbone structure through ether groups. Figure 1 depicts the reaction from monomer to prepolymer to thermoset network. The resulting cured matrix has several interesting characteristics. In most cases, this type of linkage provides greater flexibility and higher strain to failure of the cured polymer than multifunctional, unmodified epoxies and bismaleimide resins (Ref 3, 5). Fig. 1 Cure of cyanate resins by cyclotrimerization of cyanate ester monomer and prepolymer Table 1 Available forms of cyanate ester resins Cost Form Structure Physical state $/kg $/lb Applications XU366, 378 Viscous liquid, amorphous semisolid 29– 34 65– 75 Telecommunication satellites, radomes, adhesives (120 °C, or 250 °F, cure) Bisphenol A dicyanate Crystal powder, viscous liquids, solid flake, solution 9– 14 20– 30 Radomes, multilayer high-speed printed circuit boards, solvent for thermoplastics Ortho methyl dicyanate Crystal powder, semisolid, amorphous solid 11– 14 25– 30 Radomes, primary structures, flexible circuitry, high-speed printed circuit boards, adhesives L-10 monomes Low viscosity liquid or crystal 36– 45 80– 100 Radomes, satellites, syntactic foams, primary structures, solvent for thermoplastics XU7187 dicyclopentadiene Semisolid amorphous (0.7L is core shell rubber toughened) 36– 50 80– 110 Telecommunications or satellites, primary structures, structural syntactic cores, radomes, adhesives Phenol triazine PT- 30, 60 Viscous liquid or semisolid amorphous 27– 34 60– 75 High-temperature applications: wet winding, carbon-carbon, ablatives Data courtesy of Vantico, formerly Ciba Giegy The selection of catalyst is important to the curing process of CE resins. Studies performed by D. Shimp et al. show that cure rates can vary depending on the type, addition level, and whether or not a reaction accelerator is used. The most common type of catalysts are chelates and carboxylate salts of transition metals. The metals act as coordination catalysts and complex with the -OCN groups, bringing three reactive groups together to form the triazine ring structure. The reaction does not evolve any volatiles. The transition metal used to catalyze the polymerization does not play an important role in the final properties of the fully cured polymer. This means that the same triazine ring structure will be produced, regardless of the type of transition metal selected; however, it does directly affect its percent conversion and cure rate at specific temperatures, which in turn affect the glass transition temperature (T g ) and the thermal oxidative and hydrolytic stability of the cured system. Cyanate ester resins are autocatalytic at temperatures above 200 °C (390 °F) and can be cured without catalyst. Their heat of reaction is higher than epoxy resins, which can be problematic if attempting fast cure cycles of thick laminates or compounding large masses of polymer at elevated temperatures. The heat of reaction for the OCN groups are approximately 105 kJ/mole compared to 50 to 58 kJ/mole for epoxy systems. Cyanate ester resins are also sensitive to contaminants and impurities, especially phenols, transition metals, amines, Lewis acids, alcohols, and water, which will all increase the reaction rate (Ref 1, 6). References cited in this section 1. A.W. Snow, The Synthesis, Manufacture and Characterization of Cyanate Ester Monomers, Chemistry and Technology of Cyanate Ester Resins, Hamerton, 1994 3. D.A. Shimp, J.R. Christenson, and S.J. Ising, “Cyanate Ester Resins—Chemistry, Properties and Applications,” Technical Bulletin, Ciba, Ardsley, NY, 1991 5. R.J. Zaldivar, “Chemical Characterization of Polycyanurate Resins,” Aerospace Technical Report 96- (8290)-1, Aerospace Corporation, 1996 6. J.P. Pascault, J. Galy, and F. Mechin, Additives and Modifiers for Cyanate Ester Resins, Chemistry and Technology of Cyanate Ester Resins, Hamerton, 1994 Cyanate Ester Resins Susan Robitaille, YLA Inc. Properties and Characteristics Many of the beneficial characteristics of CE resins contrast with those of epoxies and are directly related to the chemical structure of the resin. The most attractive attributes of CE chemistry evolve from the cured matrix structure. While there are differences in performance depending on the backbone structure and formulation, all forms contain a notably low concentration of dipoles and hydroxyl groups in the cured structure. They can also have a moderate cross-link density and high free volume. These result in lower moisture absorption, higher diffusivity, low cure shrinkage, low coefficient of thermal expansion (CTE), and low dielectric constant and dielectric loss when compared with epoxy and bismaleimide (BMI) systems. These attributes are particularly attractive for stable structures, PCBs, and radar and low dielectric applications. Figure 2 is a graph of moisture absorption of CE neat resins (RS-3) and an epoxy (3501-6), both cured at 180 °C (360 °F). The cured resins were conditioned at 100% relative humidity and 25 °C (77 °F) for more than 1000 days. The moisture absorption behavior comparison between the CE and epoxy resins shows that the CE reaches moisture equilibrium quickly and at much lower total absorption level. This is also reflected in the overall lower coefficient of moisture expansion of CE resins when compared to epoxies. Fig. 2 Moisture absorption of 180 °C (360 °F) cured epoxy and CE neat resins at 100% relative humidity and 25 °C (77 °F) for more than 1000 days The resin modulus and toughness characteristics depend, in part, on the backbone structure and cross-link density of the polymer. For satellite structures, improved toughness and elongation to failure result in fewer microcracks due to thermal cycling and a more stable structure. Figure 3 compares microcracking of several CE and epoxy resins, all of which are space-qualified systems. The laminates were made using XN- 70A, a 690 GPa (100 × 10 6 psi) modulus pitch fiber at 60% fiber volume. The CE systems produced fewer microcracks overall after 2000 cycles, with the microcrack density increasing rapidly from zero to 500 cycles and then stabilizing. The exception to this stabilization is the lower- temperature curing epoxy system (130 °C, or 270 °F) that appears to continue microcracking after 2000 cycles. Fig. 3 Comparison of microcracking behavior of cyanate ester and epoxy laminates (reinforced with graphite fiber XN70A, modulus >690 GPa, or 100 × 10 6 psi). Source: Nippon Graphite Fiber Corporation Cyanate ester can be toughened by the same mechanisms used for epoxy resins, with the expected change in the balance of modulus, T g , and strain to failure. The ability to modify and toughen CE-based resins makes them appropriate for adhesives and toughened composite applications. One prepolymer system available from Vantico, XU71787 0.07l, incorporates a proprietary submicron core shell rubber particle. It is very efficient in improving the fracture toughness (K Ic ) of the matrix at low concentrations without significantly reducing the T g of the resin. A comparison of mechanical and physical properties of cured neat resins used to formulate matrix systems is found in Table 2. All resins were cured at 175 °C (350 °F) and postcured to >95% conversion. This table shows the differences in the commercially available resins. Additional data are available from the materials suppliers (Ref 3, 7, 8). [...]... (106 psi) 28 (4.1) Warp 25 (3. 6) Weft Sources: (a) Ten Cate Advanced Composites bv (b) Cytec Fiberite Advanced Composites Polyphenylene sulfone(a) Polyetherketone ketone(b) 1. 93 1.79 32 4 (47) 30 6 (44) 30 0 (44) 296 ( 43) 23 (3. 3) 22 (3. 2) 23 (3. 3) 21 (3. 0) 526 (76) 37 8 (55) 31 7 (46) 2 83 (41) 27 (3. 9) 26 (3. 8) 21 (3. 0) 20 (2.9) 489 (71) 452 (66) 4 13 (60) 39 3 (57) 24 (3. 5) 21 (3. 0) 19 (2.8) 18 (2.6) Table... L10 XU366, XU378 Phenol triazine XU71787 0.2L XU7178 0.7L CSR 73 (11) 87 ( 13) 76 (11) 48 (7) 70 (10) … 2.97 (0.4) 2.90 (0.4) 3. 8 3. 16 (0.5) 3. 5 3. 11 (0.5) 1.9 3. 2 (0.5) … 2.7 … 119 (17) 79 (11) 124 (18) 102 (15) 3. 31 (0.5) 3. 7 3. 59 (0.5) 2.1 3. 31 (0.5) 2 .36 (0 .3) 6.6 162 ( 23) 2.9 (0.4) 8.0 4.0 7.5 175 190 210 60 70 490 252 (486) 258 (496) 182 (36 0) 32 0 (608) 265 (509) 254 (489) 71 (39 ) 64 (36 ) 70 (39 )... Polyphenylene sulfide (PPS) Polyetherimide (PEI) 88 190 285 545 218 424 … … Polypropylene (PP) HDTUL(a) Processing temperature °C °F °C °F 99 210 191– 37 5– 224 435 149 30 0 232 – 450– 246 475 86 187 199– 39 0– 246 475 177 35 0 246– 475– 274 525 138 280 200– 39 2– 240 464 181 35 8 32 9– 625– 34 3 650 210 410 31 6– 600– 36 0 680 171 34 0 38 2– 720– 39 9 750 … … 32 7– 620– 36 0 680 Type of morphology Crystalline Crystalline Amorphous... (34 ) 32 7 (47) 427 (62) 578 (84) 35 (5) 26 (4) 67 (10) Modulus of elasticity, GPa (106 psi) D 30 39 0 .31 … 0 .32 … … … … Poisson's ratio D 30 39 … … 0 .38 … … … … Ultimate strain, % Tensile properties at 90º D 30 39 43. 6 (6 .3) 33 (5) 45 (7) 16.5 (2.4) … … 107 (16) Tensile strength, MPa (ksi) D 30 39 6.5 (0.9) 6.5 (0.9) 6.8 (1.0) 4.1 (0.6) … … 42 (6) Modulus of elasticity, GPa (106 psi) … 0.004 … … … … D 30 39... 50 (7.2) 46 (6.7) 51 (7 .3) Weft 118 (17.1) 110 (16.0) 125 (18.1) 100 (14.5) In-plane shear strength, MPa (ksi) 3. 4 (0.49) 4.2 (0.60) 3. 4 (0.49) 3. 9 (0.57) In-plane shear modulus, GPa (106 psi) 270 (39 .2) 274 (39 .7) 261 (37 .9) 261 (37 .9) Open-hole tensile strength, MPa (ksi) Open-hole compression strength, MPa (ksi) 268 (38 .9) 259 (37 .6) 275 (39 .9) 239 (34 .7) … 39 1 (56.7) … 35 2 (51.1) Bearing strength... engine tunnels Airbus A 33 0-2 00 rudder nose ribs Polyphenylene Airbus A340 aileron ribs sulfide Airbus A34 0-5 00/600 fixed-wing leading-edge assemblies Airbus A34 0-5 00/600 inboard wing access panels Airbus A34 0-5 00/600 keel beam connecting angles Airbus A34 0-5 00/600 keel beam ribs Airbus A34 0-5 00/600 pylon panels Fokker 50 main landing gear door 737 smoke detector pans Polyetherimide 737 /757 galleys 747... 40 (6) 35 (5) 68.9 (10.0) 76 (11) D 234 4 72 (10) Short beam shear, MPa (ksi) 90 ( 13) 58.6 29 (4) … … 138 (20) In-plane shear D 35 18 84 (12) (8.5) strength, MPa (ksi) 4.8 (0.7) 4.4 (0.6) 4.7 (0.7) … … 4.8 (0.7) In-plane shear D 35 18 3. 8 (0.6) modulus, GPa (106 psi) D 790 132 4 1206 586 (85) 571 ( 83) 415 (60) 897 ( 130 ) 1020 Flexural (192) (175) (148) strength, MPa (ksi) D 790 226 (33 ) 297 ( 43) 31 7 (46)... 101 (14.7) Short-beam shear strength, MPa (ksi) Sources: (a) Cytec Fiberite Advanced Composites (b) Hexcel Composites Properties AS4/PEEK(a) IM7/PEEK(a) 61 2070 (30 0) 138 (20.0) 12 83 (186) 124 (18.0) 2000 (290) 124 (18.0) 186 (27.0) 5.7 (0. 83) 38 6 (56.0) 32 4 (47.0) 33 8 (49.0) 61 2896 (420) 169 (24.5) 1206 (175) … 2084 (30 2) 157 (22.8) 179 (26.0) 5.5 (0.80) 476 (69.0) 32 4 (47.0) 37 0 ( 53. 7) … … … … …... (106 psi) … 0.004 … … … … D 30 39 0.0040 Poisson's ratio Compressive properties at 0º 834 ( 121) 33 4 (48) 31 5 (46) 279 (40) 538 (78) 814 Compressive D 695 1179 (171) (118) strength, MPa MOD (ksi) 33 .6 (4.9) 25.5 (3. 7) 61.0 30 1 (44) 4 23 (61) 557 (81) Compressive D 695 220 (32 ) (8.8) modulus, GPa MOD 6 (10 psi) Compressive properties at 90º … … … … … … Compressive D 695 234 (34 ) MOD strength, MPa (ksi) …... 62 (34 ) 66 (37 ) 66 (37 ) … … … … 1250 1250 4 03 (757) 39 0 ( 734 ) 39 412 (774) 62 405 (761) … 48 408 (766) 43 32 … 20 14 1 >50 >50 … 14 7 >50 … … … 1 .3 2.4 0.6 3. 8 1.2 … >600 NA NA NA >600 … >70 NA 28 NA 10 … 2.67 2.85 2. 53 2.97 2.76 … Bisphenol A Ortho dicyanate methyl dicyanate Mechanical properties 88 ( 13) Tensile strength, MPa (ksi) 3. 17 (0.5) Tensile modulus, 6 GPa (10 psi) Elongation to break, 3. 2 . (85) 689 (100) 834 ( 121) Modulus of elasticity, GPa (10 6 psi) D 30 39 234 (34 ) 32 7 (47) 427 (62) 578 (84) 35 (5) 26 (4) 67 (10) Poisson's ratio D 30 39 0 .31 … 0 .32 … … … … . 30 39 … … 0 .38 … … … … Tensile properties at 90º Tensile strength, MPa (ksi) D 30 39 43. 6 (6 .3) 33 (5) 45 (7) 16.5 (2.4) … … 107 (16) Modulus of elasticity, GPa (10 6 psi) D 30 39 . Coefficient of thermal expansion (TGA), 10 -6 /°C (10 - 6 /°F) 64 (36 ) 71 (39 ) 64 (36 ) 70 (39 ) 62 (34 ) 66 (37 ) 66 (37 ) Coefficient of moisture expansion, 10 -6 /%M … … … … … 1250 1250 Onset of