... point (c-Si) and ring (SiC) electron diffraction patterns (Fig.4b, c, 5b and 6b). Silicon Carbide – Materials, Processing and Applications in Electronic Devices 86At respecting certain ... carbon and oxygen, respectively, in a layer after high-dose implantation and annealing at T = 1250°C for 30 min. Silicon Carbide – Materials, Processing and Applications in Electronic Devices ... SiC1 .4 , 2 - SiC0.95, 3 - SiC0.7, 4 - SiC0 .4 , 5 - SiC0.12, 6 - SiC0.03. Silicon Carbide – Materials, Processing and Applications in Electronic Devices 80 In the layer SiC0 .4 ...